According to CoinMeta, as reported by Nikkei News, Sony Group and TSMC plan to start mass-producing the next generation of image sensor semiconductors as early as 2029 in Kumamoto Prefecture in southwestern Japan. The joint venture responsible for production will be held by Sony with about 60% of the shares and TSMC with about 40%, with a total investment expected to reach around 1 trillion yen (about 6.3 billion US dollars). It is anticipated that the two companies will reach an agreement on large-scale production investment in the near future and establish the joint venture before the end of the 2026 fiscal year. This joint venture is expected to supply high-performance camera sensors for Apple. Looking to the future, the two companies aim to improve sensor performance so that artificial intelligence systems can identify objects more accurately, with the target application areas being the emerging "physical AI".