According to CoinMeta, TSMC recently stated that its advanced packaging technology has made breakthroughs in the AI chip field, with the production yield of some products having increased to 98% to 99%. He Jun, the vice president of TSMC's Advanced Packaging Technology and Services, revealed that this excellent yield performance is mainly for AI products packaged using a 5.5x mask size (reticle size). Currently, the 5.5x mask size (CoWoS) has entered mass production, and it is expected to be expanded to a 14x mask size by 2029.