According to CoinMeta, on the afternoon of August 14th, the "Special Seminar on High-Computing-Power New Substrate Technology Routes" jointly organized by the Key Laboratory of Artificial Intelligence Scenario Innovation and Intelligent Chips Evaluation of the Ministry of Industry and Information Technology, which is affiliated with CCID Research Institute, and the Artificial Intelligence Industry Working Committee, was held at the CCID Building in Beijing. The experts present unanimously agreed that the current new substrates are in a period of industrialization. The main bottlenecks include insufficient coordination among "materials, equipment, processes, and end-users," the lack of standards, and the absence of pilot production platforms. Issues such as key materials, specialized equipment, and advanced packaging may lead to new obstacles due to mismatches between supply and demand and concentrated supply chains. There is also a lack of reliability data and unified testing standards, which results in material companies being hesitant to invest and end-user companies being reluctant to adopt these new technologies. Experts suggested strengthening capacity monitoring and early warning systems, promoting diversified supply sources and technical backups, establishing cross-disciplinary joint research mechanisms, and creating demonstration application zones to accelerate the substitution of domestic products. This approach aims to break through the industrial closed loop from laboratories to production lines and from materials to end-users.