IT News on October 8th: Research institution Counterpoint Research reported on September 29th that the total revenue of the global wafer foundry 2.0 market reached $96.6 billion in the second quarter of 2026, a year-on-year increase of 25% and a quarter-on-quarter increase of 11%, indicating a faster growth rate than in the previous quarter.

In terms of segmentation, the revenue of the pure wafer foundry industry increased by 29% year-on-year to $54.9 billion; non-storage IDM revenue increased by 19% year-on-year; OSAT revenue increased by 22% year-on-year and 12% month-on-month, reaching $12.6 billion; while masks and other categories saw a year-on-year increase of 6%.

TSMC contributed 42% of the total wafer foundry revenue with $40.2 billion; revenue increased by 34% year-on-year and 12% quarter-on-quarter; institutions expect its annual revenue growth to reach around 43%. The revenue of pure wafer foundries other than TSMC increased by 18% year-on-year, with SMIC's growth reaching 36%. Intel's wafer foundry revenue increased by 31% year-on-year.

Institutions predict that within the next five years, over 130 million GPU and AI ASIC devices equipped with advanced packaging technology for compute-side memory will be shipped, generating nearly $2 trillion in revenue related to computing; TSMC's CoWoS supply-demand gap will remain around 20% this year and is expected to narrow to 10% by 2027.

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Global Foundry 2.0 Revenue Rises 25% YoY to a Record $96.6 Billion in Q2 2026 as Advanced Packaging Takes Center Stage