News from the home of IT on October 21st: According to a report by the Japanese media "Nikkei Industrial News" yesterday local time, Canon (Canon) plans to increase its lithography machine production capacity for semiconductor back-end processes by 50% by 2029 compared to the current level.
Canon is developing i-line lithography equipment for advanced packaging processes. The company has also developed a large-size substrate lithography machine with a resolution of 0.8μm (800nm), capable of processing substrates measuring 510×515 millimeters, and features high alignment precision and a wide field of view.
In an interview, Sanpei Mitamura, the person in charge of Canon's Semiconductor Equipment Division, stated that the maskless direct writing patterning solution is not currently a direct competitor to i-line lithography machines in the RDL production field.
Related Reading:
Canon Establishes a New Lithography Machine Factory After 21 Years, Focusing on the Demand for Non-Advanced Machines (August 5, 2025)












