Hsinchu County, Taiwan, November 2nd / PRNewswire / -- Ceva , Inc . (Nasdaq ticker: CEVA) Today, the company announced that in its IPnest September 2026 Design IP report, it continued to maintain its number one position in IP wireless interfaces. As AI expands to billions of connected devices, reliable and ultra-low power consumption wireless connections have become crucial for sharing data and context between these devices.
This category is expected to grow by about 14% in 2025. Ceva holds a market share of 68% based on IP revenue, which is 12 times that of the second-largest manufacturer. This result continues Ceva's leading position as reported in previous IPnest reports: 67% in 2023 and 68% in 2024. Ceva estimates that its wireless connectivity IP is used in approximately 30% of global Bluetooth-enabled IoT devices each year, as well as 15% of IoT devices that support Wi-Fi.
Through the Ceva-Waves product portfolio, Ceva authorizes Bluetooth, Wi-Fi, UWB, 802.15.4, and cellular IoT technologies to semiconductor companies and IP, helping them to create differentiated products. The company's Bluetooth technology has over 100 licensees, while Wi - Fi IP has more than 60 licensees, and over 30 customers utilize both types of these technologies simultaneously. Ceva is leveraging this broad coverage to advance Bluetooth High Data Throughput ( HDT ), develop Wi-Fi 8, and expand its connectivity product portfolio through PentaG-Edge. PentaG-Edge is a 5G- Advanced modem IP subsystem for edge devices. These investments help customers launch intelligent connected products in consumer electronics, automotive, industrial, PC, and IoT applications, as devices increasingly need to exchange data with each other, with networks, and with the cloud.
Wireless IP is an important pillar of Ceva's " Connect , Sense , Infer " strategy. When combined with the company's sensing IP and NeuPro NPU, it provides chip manufacturers with system-level IP for Physical AI. This means that the appropriate AI models can run at the right time and in the right place. Local inference is responsible for tasks that are sensitive to latency and power consumption, while the connectivity capability connects each device to its peers as well as to the cloud.
Ceva, the Executive Vice President of Connectivity and Sensing Division, stated to Ziv Hammer: "AI is becoming an experience that follows people from one device to another. Each device needs to exchange data and context, perceive the surrounding environment, and interpret the information it perceives locally. We continue to maintain a leading position in the field of wireless IP, which reflects customers' trust in Ceva. Our multi-standard product portfolio provides companies across the industry with the connectivity capabilities needed to build the next generation of smart products."
Ceva will share its wireless connectivity and Physical AI roadmap at technical seminars to be held in Hsinchu, Taiwan on November 2nd, and in Shanghai, China on November 5th. For more information about Ceva-Waves wireless connectivity IP, please visit: https :// www.ceva-ip.com / product / ceva-waves-links /.
Market share and vendor comparison are based on the estimates of wireless interface IP revenue in the Design IP report for September 2026 from IPnest.
About Ceva
Ceva powers the intelligent edge, connecting the digital world with the physical world, making the products driven by AI a reality. The company's combination of Ceva AI fabric silicon and software IP enables devices to achieve Connect, Sense, and Infer – these are the core capabilities essential for the intelligent edge. From 5G, cellular IoT, Bluetooth, Wi-Fi, and UWB connectivity, to scalable edge AI NPU, AI DSP, sensor fusion processors, and embedded software, Ceva provides the foundation necessary for devices to connect, understand their environment, and act in real time.
Ceva has shipped over 22 billion devices and has gained the trust of more than 400 customers worldwide, making it a pillar of today's most advanced intelligent edge products – ranging from wearable devices and Internet of Things (IoT) devices empowered by AI to autonomous vehicles and 5G infrastructure. The company's differentiated solutions can be seamlessly integrated into existing design processes, providing highly flexible combination capabilities and ultra-low power consumption performance in the smallest chip area, helping customers accelerate development, reduce risks, and bring innovative products to market more quickly. As technology evolves towards Physical AI, IP from Ceva lays the foundation for systems that are always connected, context-aware, and capable of making intelligent real-time decisions.
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