Pre-authenticated multi-protocol modules and advanced IO-Link main stations have expanded the industrial communication product portfolio of TI, aiming to support a future-oriented industrial network ecosystem.

News Highlights:

• TICS100MOD is the smallest multi-protocol communication system module with complete functionality in the industry (SoM). It can support EtherCAT, EtherNet / IP, and Profinet on a single, compact hardware, thereby simplifying industrial Ethernet integration.
• TIOM2212 is an advanced dual-channel IO-Link main station used to connect field devices to industrial Ethernet networks, simplifying the integration of sensors and actuators into factory control systems.
• The multi-protocol solution of TI allows engineers to switch between different industrial Ethernet protocols through simple firmware updates, reducing design complexity and providing forward-looking support for the industrial network ecosystem.

Dallas, November 5th / PRNewswire / -- Texas Instruments ( TI ) (Nasdaq ticker: TXN ) announced today the launch of two new devices aimed at providing seamless interoperability for increasingly complex factory automation, robotics, and industrial Internet of Things systems. A multi-protocol communication system module ( SoM ) and a IO-Link master station expand TI's industrial communication product portfolio. This portfolio includes hardware that can be programmed via software, as well as certified software protocol stacks that can be used directly in mass production, helping engineers to run any established protocol on a single integrated platform.

TI, Director of Industrial Communication Solutions, stated: "Industrial communication is evolving at an unprecedented pace, and engineers need a partner who can help them adapt to emerging standards and requirements. TI combines certified hardware, software, and internal engineering expertise to support customers in developing the next generation of industrial automation systems, enabling seamless collaboration between different devices, networks, and communication protocols."

SICK Senior Vice President of R&D and Integration Automation Dr. Stefan Odermatt states: "At SICK, we rely on robust and future-oriented communication technologies to connect sensors, machines, and systems. The industrial Ethernet of TI and IO-Link solutions have helped us bring products such as SIG300 to market, meeting the performance and reliability requirements of modern industrial automation."

Achieve seamless multi-protocol integration TICS100MOD Based on TI, the AM2612 microcontroller ( MCU ) and DP83826AI Ethernet physical layer chip are the smallest in the industry, featuring complete functionality and certification as communication devices. They support multiple real-time Ethernet protocols on a single piece of hardware. This SoM allows engineers to switch between EtherCAT, EtherNet / IP and Profinet through simple firmware updates at startup, providing forward-looking support for design evolution over time and making industrial Ethernet integration easier and more cost-effective. TICS100MOD SoM integrates two Arm ® Cortex ®- R5F cores along with external memory, offering sufficient computing power to support a fully functional protocol stack and advanced factory automation applications within an optimized system footprint.

TIOM2212 The dual-channel IO-Link main station extends the multi-protocol solution of TI to the level of sensors and actuators, enabling engineers to connect IO-Link devices to higher-level industrial Ethernet networks through a single platform. With advanced analog integration and built-in protection features, TIOM2212 ensures fast and reliable data exchange between field devices. This device is compatible with TI's Sitara ™ Industrial Network System-on-Chip (SoC) series and AM13Ex real-time MCU, thereby reducing the design complexity and cost of connecting field devices to factory control systems.

Accelerating Innovation in Connected Factories Interconnected factories require a variety of industrial communication protocols in order to exchange data between different devices on the production floor. Supporting multi-protocol networks usually necessitates the configuration of independent hardware for each protocol, which can increase costs, complexity of design, and time required. When a single supplier provides both hardware and software, it simplifies integration and customization, reduces supply chain risks, and makes long-term platform maintenance easier.

The multi-protocol product portfolio of TI can help engineers address these design challenges in the following ways:

• Protocol Flexibility:Firmware-based switching and customization help to meet the ever-changing needs of customers or regions without the need to redesign hardware.
• Deterministic Communication:The MCU of TI and its processor can achieve simultaneous real-time performance across multiple protocols, and possess industry-leading process data cycle times.
• Software Configurability:The complete Media Access Control (MAC) layer access permissions support highly customized protocols at each level of the protocol stack.
• Development Simplification:The evaluation module and software development suite ( SDK ) provide certified protocol stacks, application examples, training resources, as well as development and troubleshooting tools that can be used directly for mass production, in order to accelerate time-to-market of products.

Leveraging TI technology to create a future-oriented industrial network ecosystem The core of the TI single-chip multi-protocol solution is the programmable real-time unit and industrial communication subsystem ( PRU-ICSS ). This proprietary hardware module is integrated into TI's MCU and SoC, and is used to handle deterministic, low-latency industrial communication protocols. By offloading real-time communications to these dedicated cores, the general-purpose Arm CPU can focus on handling other critical functions, thereby enhancing the overall system performance.

TI's broader range of industrial communication products includes scalable SoC with integrated PRU-ICSS, real-time MCU, interface devices that comply with protocol specifications, as well as industrial communication SDK. With the addition of TIOM2212, TI can now provide hardware support for every layer of the IO-Link ecosystem, covering transceivers, digital output switches, and master devices with integrated frame processors. All these solutions are internally designed, optimized, and supported by TI, making TI the preferred partner for network engineers.

TI Debutes in electronica 2026 TI will showcase its multi-protocol industrial communication technology at the electronica exhibition to be held in Munich, Germany from November 10th to 13th. The new TICS100MOD SoM will make its debut in booth 159 of hall TI, and will be demonstrated through two presentations:

TICS100MOD Multi-protocol Industrial Ethernet: By utilizing TI certified modules that can be directly used in mass production, multi-protocol industrial Ethernet can be seamlessly integrated into any system, thereby reducing complexity and accelerating time to market.

Supply Situation TIOM2212 IO - Link The pre-production quantities of the main unit devices are now available for ordering at TI.com. TICS100MOD SoM is expected to be launched by the end of 2026. Relevant development resources have also been provided, including:

• Industrial Communication SDK
• TIOL221 Evaluation Module

About Texas Instruments Texas Instruments Incorporated (Nasdaq ticker: TXN) is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for markets such as industrial, automotive, data centers, personal electronics, and communication devices. The company's core mission is to make electronic products more affordable through semiconductors, thereby creating a better world. This mission continues to this day, as each generation of innovation builds upon the previous one, making the company's technology more reliable, more affordable, with lower power consumption, and enabling semiconductors to be integrated into ubiquitous electronic products. For more information, please visit TI.com.

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