Hsinchu, October 8, 2026 / PRNewswire-FirstCall / -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or "the Company") (Taiwan Stock Exchange: 8150; NASDAQ: IMOS), a leading provider of outsourced semiconductor packaging and testing services, today announced its unaudited consolidated revenue for the month of September 2026 and for the third quarter ending September 30, 2026. All dollar figures cited in the press release are calculated based on the exchange rate of NT$31.85 to 1 US dollar as of September 30, 2026.
The company stated that in the third quarter of 2026, revenue reached a record high. The growth in revenue was driven by the continued strong demand related to AI, with a growth rate exceeding the supply of available storage capacity. The company continues to invest in expanding its production capacity, and new production facilities are being deployed to meet the expectations of existing customers and long-term supply agreements. At the same time, structural supply constraints still exist, and demand is expanding to most of the company's storage and memory market segments.
In the third quarter of 2026, revenue amounted to NT$8.4008 billion, which is approximately $263.8 million, representing a growth of 13.8% compared to the second quarter of 2026 and 36.7% compared to the third quarter of 2025.
In September 2026, the revenue was NT$2.792 billion, which is approximately $87.7 million, representing a 0.2% increase from August 2026 and a 33.8% increase from September 2025.
Regarding ChipMOS TECHNOLOGIES INC.
ChipMOS TECHNOLOGIES INC. ("ChipMOS" or "Company") (Taiwan Stock Exchange: 8150; NASDAQ: IMOS) (www.chipmos.com) is a leading provider of outsourced semiconductor packaging and testing services. The company owns advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park, and Southern Taiwan Science Park in Taiwan, and is known for its outstanding performance and innovative history. It provides end-to-end packaging and testing services to leading fabless semiconductor companies, integrated device manufacturers, and independent semiconductor foundries, covering almost all global end markets.
Forward-looking Statements
This press release may contain certain forward-looking statements. Such forward-looking statements can be identified by words such as "believes," "expects," "anticipates," "plans," "intends," "should," "seeks," "estimates," "future," or similar expressions, or by discussions of strategies, objectives, plans, or intentions. These statements may include financial forecasts and estimates and their underlying assumptions; statements regarding the current macroeconomic conditions, including the impact of high inflation, exchange rates, and recession risks on demand for the company's products, consumer confidence, and the overall financial markets; changes in trade regulations, policies, and agreements, as well as the implementation of tariffs that affect the company's products or operations, including possible new tariffs and the company's ability to mitigate such impacts in future operations, products, and services; and statements regarding future performance. Due to a number of important factors and risks, actual results in the future may differ significantly from those reflected in the forward-looking statements in this document. These factors and risks are described in more detail in the company's most recent filings submitted to the U.S. Securities and Exchange Commission (SEC). For more information regarding these risks, uncertainties, and other factors, please refer to the company's most recent annual report Form 20-F filed with SEC and other documents submitted to SEC.
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