IT News on November 7th: Technology media The Information reported yesterday (November 6th) that TSMC is considering expanding its business scope to enter the manufacturing of advanced memory chips, in order to gain a larger share in the rapidly expanding AI hardware supply chain.

Reports indicate that TSMC has recently begun planning to produce an advanced memory chip named "3D DRAM" at the request of its largest customer, NVIDIA. This architecture enhances capacity by vertically stacking memory cells and is considered one of the key approaches to meet the high-bandwidth and high-density memory demands of AI computing power.

TSMC has not yet determined the mass production timeline, nor has it made a final decision on the source of production capacity. IT cites a blog post stating that TSMC is evaluating two options: one is to build a new dedicated factory, and the other is to acquire an existing wafer factory and convert it into memory production facilities.

If this move comes to fruition, it would mean that TSMC is expanding from its long-term focus on wafer foundry and logic chip manufacturing into the memory chip market, which has been dominated by Samsung Electronics, SK Hynix, and Micron for a long time. For NVIDIA, if it can obtain more advanced memory supplies closer to its production facilities, it will also help to alleviate the supply pressure of high-bandwidth memory required for AI accelerators.

However, this information remains merely market speculation. TSMC responded by stating, "We do not comment on market rumors or speculations," and emphasized that the company remains focused on its core business of wafer foundry services; NVIDIA, on the other hand, did not respond to requests for comments.